Melting seal packaging,a transparent window makes the sorbent seeable.

融合封，可以通过透明窗观察附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散器对DirectFET封功率MOSFET进行双散(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

和封数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的法对肖特基器件后部封中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密封的表器件（SMD）的湿气敏感度等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封完毕的液体内酯豆腐加成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封器件上的焊料球质量较小，加上封体较薄，量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合，可以通过透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热器对DirectFET功率MOSFET进行双面散热(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的法对肖特基器件后部的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密的表面安器件（SMD）的湿气敏感度等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将完毕的液体内酯豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型器件上的焊料球质量较小，加上体较薄，热量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

合封装，可以通过透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小散热器对DirectFET封装功率MOSFET进行双面散热(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用确定非气密封装的表面安装器件（SMD）的湿气敏感度等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用将封装完毕的液体内酯豆腐加热成及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由封装器件上的焊料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封装，可以通过透明窗观察吸附剂状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热器对DirectFET封装功率MOSFET进行双面散热(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少, 断掉, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验法对肖特基器件后部封装中压工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密封装表面安装器件（SMD）湿气敏感度等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封装完毕液体内酯豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上球质量较小，加上封装体较薄，热量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封装，可以通过透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热器对DirectFET封装功率MOSFET进行双面散热(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊, 缺少的, 断掉的, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的法对肖特基器件后部封装中的压焊工艺进行优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密封装的表面安装器件（SMD）的湿气敏感度等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封装完毕的液体内酯豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的焊料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封装，可以通过透明窗观剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热器对DirectFET封装功率MOSFET进行双面散热(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的法对肖特基器件后部封装中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密封装的表面安装器件（SMD）的湿气敏感度等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封装完毕的液体腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上的焊料球质量较小，加上封装体较薄，热量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封，可以通过透明窗观察吸附剂的状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型对DirectFET封功率MOSFET进行双(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸和封数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少的, 断掉的, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验的法对肖特基件后部封中的压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密封的表安件（SMD）的湿气敏感度等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封完毕的液体内酯豆腐加成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封件上的焊料球质量较小，加上封体较薄，量传送通过件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合装，可以通过透明窗观察吸附剂状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散器对DirectFET装功率MOSFET进行双散(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少, 断掉, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验法对肖特基器件后部装中压焊工艺进行了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非气密装安装器件（SMD）湿气敏感度等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将装完毕液体内酯豆腐加成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型装器件上焊料球质量较小，加上装体较薄，量传送通过器件速度很快。

Melting seal packaging,a transparent window makes the sorbent seeable.

融合封装，可以通过透明窗观察吸附剂状态。

Pavier M.Standing P.Cutler A.Sawle C.Blake A.

用小型散热器对DirectFET封装功率MOSFET面散热(M.

Heat-sink and Package datum, Pad Spacing, Gap, Length, Width, Spread, Tweeze, Missing, Broken or Un-plated Pad.

吸热和封装数据, 衬垫间距, 裂口, 长度, 宽度, 伸展, 镊子除去, 缺少, 断掉, 未电镀引线.

Finally, wirebonding technics in the retral packaging of Schottky power diodes is optimized by orthogonal experiment design.

最后用正交试验法对肖特基器件后部封装中压焊工艺了参数优化设计。

This document identifies the classification level of nonhermetic solid-state surface mount devices (SMDs) that are sensitive to moisture-induced stress.

本标准用于确定非密封装表面安装器件（SMD）敏感度等级。

It is used to shape the packaged liquid lactone tofu by means of heating and sterilize it by means of pasteurism.

用于将封装完毕液体内酯豆腐加热成型及巴氏灭菌。

The smaller mass of the solder spheres on the micropackage, coupled with a thin package, allows quick heat transfer through the component.

由于微型封装器件上焊料球质量较小，加上封装体较薄，热量传送通过器件速度很快。