hardener

Copper conductive adhesives were prepared using epoxy as matrix, the mixture of m-phenylenediamine and diaminodiphenylmethane as hardener, and copper particles as the conducting filler.

以环氧树脂为基体,间苯胺基苯甲烷的低融点混合物为固化剂,铜粉为导填料,制备了热固化各向同导胶。